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"lin kwang lung"
Showing items 26-35 of 130 (13 Page(s) Totally)
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| 國立成功大學 |
2012-07 |
The performance and fracture mechanism of solder joints under mechanical reliability test
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Jang, Wei-Luen; Wang, Tai-Siang; Lai, Yen-Fen; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-05-01 |
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
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Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-04 |
The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing
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Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2012-04 |
Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate
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Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2012-04 |
Nanoscale Electrodeposition of Copper on an AFM Tip and Its Morphological Investigations
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Mohanty, Udit Surya; Chen, S. Y.; Lin, Kwang-Lung |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012 |
A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints
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Liu, De-Shin; Hsu, Chang-Lin; Kuo, Chia-Yuan; Huang, Ya-Ling; Lin, Kwang-Lung; Shen, Geng-Shin |
| 國立成功大學 |
2011-11 |
The formation of electric circuits with carbon nanotubes and copper using tin solder
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Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2011-10 |
Supersaturation induced by current stressing
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Chiu, Ying-Ta; Liu, Chia-Hao; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2011-08 |
Electromigration-induced microstructural evolution in lead-free and lead-tin solders
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Lin, Kwang-Lung |
Showing items 26-35 of 130 (13 Page(s) Totally)
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